Technical Trends in Plastic Enclosures and Hardware - Accelerated Application of Environmental Materials

Acceleration of the Application of Environmental-Friendly Materials
The EU RoHS 3.0 regulations are becoming stricter, and connector housing materials are shifting towards bio-based plastics (such as PBT/PA66 with 30% plant fiber modification), which have been adopted in large quantities by Foxconn and Luxshare Precision.

Precision stamping competes with MIM technology.
In the manufacturing of hardware terminals, metal injection molding (MIM) technology is gradually replacing traditional stamping in the field of small-sized, complex structure components (such as Type-C tongue pieces), achieving an accuracy of ±0.01mm.

Demand for high temperature resistance and EMI shielding is increasing
New energy vehicles' high-voltage connectors have pushed the temperature resistance grade of plastic shell materials from 130°C to 180°C, with the annual usage of LCP (liquid crystal polymer) materials increasing by 15%; new nanoscale nickel shielding coating has been added to hardware coatings.